Tingfang Ji

Vice President of Engineering - Wireless R&D | Qualcomm
Chair, Technology Working Group | Next G Alliance

Tingfang Ji joined Qualcomm in 2003 and is currently a Vice President of engineering in Wireless R&D. From 2003 to 2014, he made instrumental technical contributions toward the development of LTE and LTE-Advanced technology and served as a vice chairman of the radio working group (RAN4) of 3GPP. Since 2014 he has been responsible for the flagship Qualcomm 5G/6G research project, driving Qualcomm's 5G NR air interface design/standardization efforts, sub6 GHz multi-vendor pre-commercial 5G NR IODT/trials, experimental macro network developments, and pre-6G research. Since 2022, Tingfang has been chairing the technology working group of Next G Alliance to promote North American 6G technologies. Before joining Qualcomm, Tingfang was a member of the technical staff at Bell Labs. As an inventor, he has more than 600 granted US patents. Tingfang received his Ph.D. in E.E. from the University of Michigan, Ann Arbor, in 2001 and a B.Sc. from Tsinghua University, Beijing.